Capacity: up to 50,000 wafer starts per month
Wafer size: 300 mm
Nodes: 28 nm–110 nm (starting node disputed)
Equipment: ASML lithography (MoU May 2026)
Site: 66.166 hectares in Dholera SEZ
A wafer-fabrication plant in Gujarat’s Dholera special investment region, being built by Tata Electronics with Taiwan’s Powerchip Semiconductor Manufacturing Corporation as technology partner. It is the first large-scale commercial wafer fab in India, at an investment of about ₹91,000 crore and a planned capacity of up to 50,000 wafer starts a month on 300 mm wafers. ASML signed an agreement in May 2026 to supply lithography systems. Two things about it are disputed and worth stating plainly: the starting technology node, which Tata says spans 28 nm to 110 nm while reporting has suggested production begins at 90 nm, and the timeline — Tata had targeted commercial output by the end of 2026, but the technology minister has since said mid-2028. Separately, India approved a second semiconductor mission in July 2026 with an outlay of ₹1,27,500 crore, and three packaging plants at Sanand in Gujarat are already producing.